Stellar Industries
Thermal Management Specialists
 
Metalization :: Direct Bond Copper (DBCu) ::
Beryllia, Alumina
 
Stellar Industeries is a licensee of the GE patented Direct Bond Copper process and offers custom quick turn-around prototype and production substrates to customer specifications. Circuits are available with the following general specifications:
 
• 3, 5, 8, 10 and 12 mil OFHC Copper foil
• Substrate sizes up to 5"x7"
• Substrate thickness of .015", .025" and .040"
• Custom thickness available
• Precision lapped substrates for improved camber and flatness control
• Laser scribed or Diamond Sawn edges
• Laser drilled or ultrasonically drilled holes
• Patterning to as fine as 10 mil lines and spaces
• Frontside to backside pattern alignments
• High thermal conductivity
• High electrical conductance
• Excellent adhesion
• Economical
• Hermetic packaging
• Excellent for brazing and soldering
• High temperature (1000 degrees C)
• Reworkable
• Plateable with Nickel and Gold
• Wirebondable
• Direct chip mounting
• Multilayer Construction
• Solid filled feed-thrus
• Lead frame attachments
 
 
 
Stellar Industries Corp. 50 Howe Avenue Millbury, MA 01527 | 508.865.1668 | sales@stellarind.com