Stellar Industries
Thermal Management Specialists
Aluminum Nitride Beryllium Oxide Alumina
 
Aluminum Nitride Substrates ::
Thermal Conductivity: 170 W/mK 200 W/mK available under special orders
Surface Characteristics Available:
Lapped:
16-22µinches
.0005 inch / inch Camber
+/- 0.0005" Thickness Tolerance
Polished:
1-2 µinches
<0.0005 mils/inch Camber
+/- 0.0005" Thickness Tolerance
Metalization Techniques Available:
Thick Film:
Gold, Platinum Gold
Silver, Pladium Silver,
Dielectric
Resistors less than 100 ohms/square
Thin Film:

Ti/Pt/Au
TiW/Au
Cr/Ni/Au
TaN/TiW/Au
NiCr/Ni/Au
Copper Plate-up

Refractory:
Molybdenum or Tungsten with Ni/Au Plating
Thermal Conductivity
(W/mk)
170
Coefficient of Thermal Expansion (ppm/c)
4.6
Density (gm/cm3)
3.28
Dielectric Constant
(@1ghz)
8.8
Loss Tangent (@1ghz)
0.0005
 
 
 
Stellar Industries Corp. 50 Howe Avenue Millbury, MA 01527 | 508.865.1668 | sales@stellarind.com