Stellar Industries
Thermal Management Specialists

DBC Design Guidelines

Thick Substrate Chart

Sub Material Criteria:

I. Types:

  • Al2O3: 96%, 99.5%, 99.6%
  • Sapphire [100% Al2O3]
  • BeO: 99.5% [Special-325W/mK]
  • AlN [170W/mK]

II. Sizes:

  • Preferred Standard Length & Width
  • Al2O3 @ 96%: 2" Sq., 5.43" X 7.5"
  • Al2O3 @ 99.5%: 2" Sq. 2.25" Sq.
  • Al2O3 @ 99.6%: 4" Diameter
  • Sapphire: 2" Diameter
  • BeO: 2.06" Sq., 2.3" X 2.9", 3.7" Sq.
  • AlN: 2" Sq., 3" Sq., 5.43" X 7.5"
  • Special: All types offer alternate sizes depending upon availability of material at time of order entry
  • Preferred Standard Thickness
  • 0.010", 0.015", 0.025", 0.040"
  • Lapped to Customer Specification

III. Length & Width Tolerance:

  • As Fired: 1%
  • Diced: Standard: 0.002"
  • Special: 0.001"
  • Laser Scribe & Snap: 0.005"

IV. Thickness Tolerance:

  • As Fired: 10%
  • Lapped: 0.001"
  • Special Lapped: 0.0005" or 0.0002"

V. Lapped Surface Finishes:

  • 96% Al2O3: 18-in Nominal
  • 99% Al2O3: 10-in Nominal
  • BeO: 25-in Nominal
  • AlN: 18-in Nominal

Bonded Material Criteria:

I. Cu: Per Specification: ASTM B152

II. Cu Thickness & Tolerance:

  • Offered Range {Etched}:
  • Standard: 4-12mils Per Side
  • Special: 2 or 3mils Per Side
  • Cu Thickness Only: 0.001" per side
  • Bonded Overall Thickness:
  • As Fired Sub: 0.005"
  • Lapped Sub: 0.003"
  • Special: 0.0005"

III. Pattern Tolerance:

  • Minimum Trace/Space Size: 0.010" + Cu thickness
  • Metal Feature Size: 0.005"
  • Minimum Metal Pullback:
  • From Diced Edge: 0.005" 0.005"
  • From Laser Scribe: 0.005" + half the Cu Thickness with a tolerance of 0.005"

IV. Finishes Available:

  • Electroless Phosphorous Ni:
  • Standard: 100-in Nominal
  • Special: Upon Request
  • Optional: Boron Ni
  • Electroless Au:
  • Standard: (Flash) 4-10-in
  • Special: Upon Request
  • Pb/Sn Solder: 1-4mils
  • Soldermask: 1-1.5mils
  • Laser Ablated Solder Dams

V. Thru-holes & Cu Filled Vias:

  • Hole Size: Standard 1:1 Ratio Between hole diameter & Ceramic thickness | Special: Upon Request
  • Minimum Distance Hole Edge to Diced Part Edge to be equal to whichever is larger between ceramic thickness or hole diameter
  • Minimum Filled Via Diameter: 0.020" Diameter
  • Minimum Capture Pad for a Filled Via: 0.015" radially around hole
  • Minimum Pullback from a Non-Filled Via: 0.010" 0.005"
 
 

Stellar Industries Corp. 50 Howe Avenue Millbury, MA 01527 | 877.840.1884 | 508.865.1668 | sales@stellarind.com

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